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www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 1/39 27.feb.2012 rev.001 tsz22111 ? 14 ? 001 datasheet operational amplifiers / comparators high speed with high voltage operational amplifiers ba3472, ba3472r, BA3474, BA3474r general description general-purpose ba3472,ba 3472r,BA3474,BA3474r integrate two/four indep endent op-amps and phase compensation capacitors on a single chip and have some features of high-gain, and wide operating voltage range of +3[v] to +36[v](single power supply). especially, characteristics are high slew rate (10[v/ s]) and high maximum frequency (4[mhz]). features ? operable with a single power supply ? wide operating supply voltage ? standard op-amp. pin-assignments ? internal phase compensation ? high open loop voltage gain ? internal esd protection ? operable low input voltage around gnd level ? wide output voltage range packages (typ.) (typ.) (max.) msop8 2.90mm x 4.00mm x 0.90mm ssop-b8 3.00mm x 6.40mm x 1.35mm ssop-b14 5.00 mm x 6.40mm x 1.35mm sop8 5.00mm x 6.20mm x 1.71mm sop14 8.70mm x 6.20mm x 1.71mm key specifications ? wide operating supply voltage: single supply +3.0[v] to +36.0[v] dual supply 1.5[v] to 18.0[v] ? wide temperature range: BA3474f -40[c] to +75[c] ba3472f ba3472fv ba3472fvm BA3474fv -40[c] to +85[c] ba3472rfvm BA3474rfv -40[c] to +105[c] ? low input offset current: 6[na] (typ.) ? low input bias current: 100[na] (typ.) ? wide output voltage range: vee+0.3[v]-vcc-1.0[v](typ.) with vcc-vee=30[v] ? high slew rate: 10[v/s] ? maximum frequency: 4[mhz] ? human body model (hbm): 5000[v] (typ.) selection guide product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. hi g h s p eed quad dual 30 [ ma ] / 30 [ ma ] 30 [ ma ] / 30 [ ma ] 10 [ v/ s ] 10 [ v/ s ] output current source/sink slew rate +85[c] operation guaranteed +75[c] +105[c] BA3474f ba3472rfvm ba3472f ba3472fv ba3472fvm BA3474fv BA3474rfv
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 2/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r pin configuration(top view) ordering information b a 3 4 7 x f x x - x x part number package f : sop8 sop14 fv : ssop-b8 ssop-b14 fvm : msop8 packaging and forming specification e2: embossed tape and reel (sop8/sop14/ssop-b8/ssop-b14) tr: embossed tape and reel (msop8) lineup topr supply current (typ.) slew rate (typ.) package orderable part number -40c to +75c 8.0ma 10.0v/s sop14 reel of 2500 BA3474f-e2 -40c to +85c 4.0ma sop8 reel of 2500 ba3472f-e2 ssop-b8 reel of 2500 ba3472fv-e2 msop8 reel of 3000 ba3472fvm-tr 8.0ma ssop-b14 reel of 2500 BA3474fv-e2 -40c to +105c 4.0ma msop8 reel of 3000 ba3472rfvm-tr 8.0ma ssop-b14 reel of 2500 BA3474rfv-e2 sop8 ssop-b8 msop8 sop14 ssop-b14 b a 3472f ba3472fv ba3472fvm ba3472rfvm BA3474f BA3474fv BA3474rfv 45 36 27 18 ch1 - + ch2 + - out1 -in1 +in1 vee out2 -in2 +in2 vcc 78 69 5 10 4 11 312 213 1 14 ch4 + - ch1 - + out1 -in1 +in1 vcc out3 +in3 -in3 vee ch2 - + + - ch3 out4 -in4 +in4 out2 +in2 -in2
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 3/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r absolute maximum ratings (ta=25[ ]) parameter symbol ratings unit ba3472 BA3474 ba3472r BA3474r supply voltage vcc-vee +36 v differential input voltage (*1) vid 36 v input common-mode voltage range vicm (vee - 0.3) to vee + 36 v operating temperature range topr -40 to +85(sop14 : +75) -40 to +105 storage temperature range tstg -55 to +150 maximum junction temperature tjmax +150 note: absolute maximum rating item indicates the condition which must not be exceeded. application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may c ause deterioration of characteristics. (*1) the voltage difference between inverting input and non-inverting input is the differential input voltage. then input terminal voltage is set to more than vee. electrical characteristics ba3472 (unless otherwise specifi ed vcc=+15[v], vee=-15[v], ta=25[ ]) parameter symbol temperature range limits unit condition ba3472f/fv/fvm min. typ. max. input offset voltage (*2) vio 25 - 1 10 mv vicm=0[v],vout=0[v] - 1.5 10 vcc=5[v],vee=0[v],vicm=0[v], vout=vcc/2 input offset current (*2) iio 25 - 6 75 na vicm=0[v],vout=0[v] input bias current (*2) ib 25 - 100 500 na vicm=0[v],vout=0[v] supply current icc 25 - 4 5.5 ma rl= high level output voltage voh 25 3.7 4 - v vcc=5[v],rl=2[k ? ] 13.7 14 - rl=10[k ? ] 13.5 - - rl=2[k ? ] low level output voltage vol 25 - 0.1 0.3 v vcc=5[v],rl=2[k ? ] - -14.7 -14.3 rl=10[k ? ] - - -13.5 rl=2[k ? ] large signal voltage gain av 25 80 100 - db rl R 2[k ? ],vout=10 [v] input common-mode voltage range vicm 25 0 - vcc-2.0 v vcc=5[v],vee=0[v], vout=vcc/2 common-mode rejection ratio cmrr 25 60 97 - db vicm=0[v],vout=0[v] power supply rejection ratio psrr 25 60 97 - db vicm=0[v],vout=0[v] output source current (*3) ioh 25 10 30 - ma vcc=5[v],vin+=1[v], vin-=0[v],vout=0[v] only 1ch is short circuit output sink current (*3) iol 25 20 30 - ma vcc=5[v],vin+=0[v], vin-=1[v],vout=5[v], only 1ch is short circuit maximum frequency ft 25 - 4 - mhz - slew rate sr 25 - 10 - v/ s av=1,vin=-10 to +10[v], rl=2[k ? ] channel separation cs 25 - 120 - db - (*2) absolute value (*3) under high temperatures, please consider the power dissipation when selecting the output current. when the output terminal is continuously shorted the ou tput current reduces the inter nal temperature by flushing.
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 4/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r ba3472r (unless otherwise specified vcc=+15[v], vee=-15[v], ta=25[ ]) parameter symbol temperature range limits unit condition ba3472rfvm min. typ. max. input offset voltage (*4) vio 25 - 1 10 mv vicm=0[v],vout=0[v] - 1.5 10 vcc=5[v],vee=0[v],vicm=0[v], vout=vcc/2 input offset current (*4) iio 25 - 6 75 na vicm=0[v],vout=0[v] input bias current (*4) ib 25 - 100 500 na vicm=0[v],vout=0[v] supply current icc 25 - 4 5.5 ma rl= high level output voltage voh 25 3.7 4 - v vcc=5[v],rl=2[k ? ] 13.7 14 - rl=10[k ? ] 13.5 - - rl=2[k ? ] low level output voltage vol 25 - 0.1 0.3 v vcc=5[v],rl=2[k ? ] - -14.7 -14.3 rl=10[k ? ] - - -13.5 rl=2[k ? ] large signal voltage gain av 25 80 100 - db rl R 2[k ? ],vout=10 [v] input common-mode voltage range vicm 25 0 - vcc-2.0 v vcc=5[v],vee=0[v], vout=vcc/2 common-mode rejection ratio cmrr 25 60 97 - db vicm=0[v],vout=0[v] power supply rejection ratio psrr 25 60 97 - db vicm=0[v],vout=0[v] output source current (*5) ioh 25 10 30 - ma vcc=5[v],vin+=1[v], vin-=0[v], vout=0[v] only 1ch is short circuit output sink current (*5) iol 25 20 30 - ma vcc=5[v],vin+=0[v], vin-=1[v], vout=5[v] only 1ch is short circuit maximum frequency ft 25 - 4 - mhz - slew rate sr 25 - 10 - v/ s av=1,vin=-10 to +10[v], rl=2[k ? ] channel separation cs 25 - 120 - db - (*4) absolute value (*5) under high temperatures, please consider the power dissipation when selecting the output current. when the output terminal is continuously shorted the ou tput current reduces the inter nal temperature by flushing.
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 5/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r BA3474 (unless otherwise specified vcc=+15[v], vee=-15[v], ta=25[ ]) parameter symbol temperature range limits unit condition BA3474f/fv min. typ. max. input offset voltage (*6) vio 25 - 1 10 mv vicm=0[v],vout=0[v] - 1.5 10 vcc=5[v],vee=0[v], vicm=0[v] vout=vcc/2 input offset current (*6) iio 25 - 6 75 na vicm=0[v],vout=0[v] input bias current (*6) ib 25 - 100 500 na vicm=0[v],vout=0[v] supply current icc 25 - 8 11 ma rl= high level output voltage voh 25 3.7 4 - v vcc=5[v],rl=2[k ? ] 13.7 14 - rl=10[k ? ] 13.5 - - rl=2[k ? ] low level output voltage vol 25 - 0.1 0.3 v vcc=5[v],rl=2[k ? ] - -14.7 -14.3 rl=10[k ? ] - - -13.5 rl=2[k ? ] large signal voltage gain av 25 80 100 - db rl R 2[k ? ], vout=10 [v] input common-mode voltage range vicm 25 0 - vcc-2.0 v vcc=5[v],vee=0[v], vout=vcc/2 common-mode rejection ratio cmrr 25 60 97 - db vicm=0[v],vout=0[v] power supply rejection ratio psrr 25 60 97 - db vicm=0[v],vout=0[v] output source current (*7) ioh 25 10 30 - ma vcc=5[v],vin+=1[v], vin-=0[v], vout=0[v] only 1ch is short circuit output sink current (*7) iol 25 20 30 - ma vcc=5[v],vin+=0[v], vin-=1[v], vout=5[v] only 1ch is short circuit maximum frequency ft 25 - 4 - mhz - slew rate sr 25 - 10 - v/ s av=1,vin=-10 to +10[v], rl=2[k ? ] channel separation cs 25 - 120 - db - (*6) absolute value (*7) under high temperatures, please consider the power dissipation when selecting the output current. when the output terminal is continuously shorted the ou tput current reduces the inter nal temperature by flushing.
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 6/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r BA3474r (unless otherwise specified vcc=+15[v], vee=-15[v], ta=25[ ]) parameter symbol temperature range limits unit condition BA3474rfv min. typ. max. input offset voltage (*8) vio 25 - 1 10 mv vicm=0[v],vout=0[v] - 1.5 10 vcc=5[v],vee=0[v],vicm=0[v], vout=vcc/2 input offset current (*8) iio 25 - 6 75 na vicm=0[v],vout=0[v] input bias current (*8) ib 25 - 100 500 na vicm=0[v],vout=0[v] supply current icc 25 - 8 11 ma rl= high level output voltage voh 25 3.7 4 - v vcc=5[v],rl=2[k ? ] 13.7 14 - rl=10[k ? ] 13.5 - - rl=2[k ? ] low level output voltage vol 25 - 0.1 0.3 v vcc=5[v],rl=2[k ? ] - -14.7 -14.3 rl=10[k ? ] - - -13.5 rl=2[k ? ] large signal voltage gain av 25 80 100 - db rl R 2[k ? ],vout=10 [v] input common-mode voltage range vicm 25 0 - vcc-2.0 v vcc=5[v],vee=0[v], vout=vcc/2 common-mode rejection ratio cmrr 25 60 97 - db vicm=0[v],vout=0[v] power supply rejection ratio psrr 25 60 97 - db vicm=0[v],vout=0[v] output source current (*9) ioh 25 10 30 - ma vcc=5[v],vin+=1[v], vin-=0[v],vout=0[v], only 1ch is short circuit output sink current (*9) iol 25 20 30 - ma vcc=5[v],vin+=0[v], vin-=1[v],vout=5[v], only 1ch is short circuit maximum frequency ft 25 - 4 - mhz - slew rate sr 25 - 10 - v/ s av=1,vin=-10 to +10[v],rl=2[k ? ] channel separation cs 25 - 120 - db - (*8) absolute value (*9) under high temperatures, please consider the power dissipation when selecting the output current. when the output terminal is continuously shorted the ou tput current reduces the inter nal temperature by flushing.
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 7/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r description of electri cal characteristics described below are descriptions of the relevant electrical terms please note that item names, symbols and their meanings ma y differ from those on another manufacturer?s documents. 1. absolute maximum ratings the absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration of electrical characteristics or damage to the pa rt itself as well as peripheral components. 1.1 power supply voltage (vcc-vee) expresses the maximum voltage that can be supplied betw een the positive and negative supply terminals without causing deterioration of the electr ical characteristics or destruction of the internal circuitry. 1.2 differential input voltage (vid) indicates the maximum voltage that can be supplied betw een the non-inverting and inverting terminals without damaging the ic. 1.3 input common-mode voltage range (vicm) signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing deterioration of the characteristics or damage to the ic itself. normal operation is not guaranteed within the common-mode voltage range of the maximum ratings ? us e within the input common-mode voltage range of the electric characteristics instead. 1.4 power dissipation (pd) indicates the power that can be consumed by a part icular mounted board at ambient temperature (25 ). for packaged products, pd is determined by the maximum junction temperature and the thermal resistance. 2. electrical characteristics 2.1 input offset voltage (vio) signifies the voltage difference between the non-inverting and inverting terminals. it can be thought of as the input voltage difference required for setting the output voltage to 0 v. 2.2 input offset current (iio) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. 2.3 input bias current (ib) denotes the current that flows into or out of the input terminal, it is defined by t he average of the input bias current at the non-inverting terminal and the input bi as current at the inverting terminal. 2.4 circuit current (icc) indicates the current of the ic itse lf that flows under specified conditi ons and during no-load steady state. 2.5 maximum output voltage (vom) indicates the voltage range that can be output by the ic under specified load condition. it is typically divided into high-level output voltage and low-level output voltage. 2.6 large signal voltage gain (av) the amplifying rate (gain) of the output voltage against the voltage differenc e between non-inverting and inverting terminals, it is (normally) the amplifying rate (gain) with respect to dc voltage. av = (output voltage fluctuation) / (input offset fluctuation) 2.7 input common-mode voltage range (vicm) indicates the input voltage range un der which the ic operates normally. 2.8 common-mode rejection ratio (cmrr) signifies the ratio of fluctuation of t he input offset voltage when the in-phase i nput voltage is changed (dc fluctuation). cmrr = (change in input common-mode volt age) / (input offset fluctuation) 2.9 power supply rejection ratio (psrr) denotes the ratio of fluctuation of the input offset voltage when supply voltage is changed (dc fluctuation). svr = (change in power supply voltage) / (input offset fluctuation) 2.10 channel separation (cs) expresses the amount of fluctuation of the input offset voltage or output volt age with respect to the change in the output voltage of a driven channel. 2.11 slew rate (sr) indicates the time fluctuation ra tio of the output voltage when an i nput step signal is supplied. 2.12 maximum frequency (ft) indicates a frequency where the voltage gain of op-amp is 1. 2.13 total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of output voltage with re ference to the change of output voltage of driven channel. 2.14 input referred noise voltage (vn) indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal.
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 8/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r circuit diagram vcc vin- v in+ vee vout fig.1 schematic diagram (one channel only)
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 9/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r typical performance curves ba3472 fig.2 derating curve fig.3 supply current - supply voltage fig.4 supply current - ambient temperature fig.5 high level output voltage - supply voltage (rl=10[k ? ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 10/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.6 high level output voltage - ambient temperature (rl=10[k ? ]) fig.7 low level output voltage - supply voltage (rl=10[k ? ]) fig.8 low level output voltage - ambient temperature (rl=10[k ? ]) fig.9 output source current - (vcc-vout) (vcc/vee=5[v]/0[v])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 11/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r (*)the data above is ability value of sample, it is not guaranteed fig.10 output source current - (vout-vee) (vcc/vee=5[v]/0[v]) fig.11 input offset voltage - common model input voltage (vcc/vee=15[v]/-15[v]) fig.12 input offset voltage - supply voltage fig.13 input offset voltage - ambient temperature
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 12/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.14 input bias current - supply voltage fig.15 input bias current - ambient temperature fig.16 large signal voltage gain -supply voltage fig.17 large signal voltage gain -ambient temperature
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 13/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.18 common mode rejection ratio -supply voltage fig.19 common mode rejection ratio -ambient temperature fig.20 slew rate l-h - supply voltage (rl=10[k ? ]) fig.21 slew rate l-h - ambient temperature (rl=10[k ? ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 14/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r (*)the data above is ability value of sample, it is not guaranteed fig.22 voltage gain - frequency (vcc=7.5[v]/-7.5[v], av=40[db], rl=2[k ? ],cl=100[pf],ta=25[ ]) fig.23 input / output voltage - time (vcc/vee=15[v]/-15[v], av=0[db], rl=2[k ? ],cl=100[pf],ta=25[ ]) fig.24 input / output voltage - time (vcc/vee=15[v]/-15[v], av=0[db], rl=2[k ? ], cl=100[pf], ta=25[ ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 15/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r BA3474 fig.25 derating curve fig.26 supply current - supply voltage fig.27 supply current - ambient temperature fig.28 high level output voltage - supply voltage (rl=10[k ? ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 16/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.29 high level output voltage - ambient temperature (rl=10[k ? ]) fig.30 low level output voltage - supply voltage (rl=10[k ? ]) fig.31 low level output voltage - ambient temperature (rl=10[k ? ]) fig.32 output source current - (vcc-vout) (vcc/vee=5[v]/0[v])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 17/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r (*)the data above is ability value of sample, it is not guaranteed fig.33 output source current - (vout-vee) (vcc/vee=5[v]/0[v]) fig.34 input offset voltage - common model input voltage (vcc/vee=15[v]/-15[v]) fig.35 input offset voltage - supply voltage fig.36 input offset voltage -ambient temperature
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 18/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.37 input bias current - supply voltage fig.38 input bias current - ambient temperature fig.39 large signal voltage gain -supply voltage fig.40 large signal voltage gain -ambient temperature
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 19/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.41 common mode rejection ratio -supply voltage fig.42 common mode rejection ratio -ambient temperature fig.43 slew rate l-h - supply voltage (rl=10[k ? ]) fig.44 slew rate l-h - ambient temperature (rl=10[k ? ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 20/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r (*)the data above is ability value of sample, it is not guaranteed. fig.45 voltage gain - frequency (vcc=7.5[v]/-7.5[v], av=40[db], rl=2[k ? ],cl=100[pf],ta=25[ ]) fig.46 input / output voltage - time (vcc/vee=15[v]/-15[v], av=0[db], rl=2[k ? ],cl=100[pf],ta=25[ ]) fig.47 input / output voltage - time (vcc/vee=15[v]/-15[v], av=0[db], rl=2[k ? ],cl=100[pf],ta=25[ ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 21/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r ba3472r fig.48 derating curve fig.49 supply current - supply voltage fig.50 supply current - ambient temperature fig.51 high level output voltage - supply voltage (rl=10[k ? ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 22/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.52 high level output voltage - ambient temperature (rl=10[k ? ]) fig.53 low level output voltage - supply voltage (rl=10[k ? ]) fig.54 low level output voltage - ambient temperature (rl=10[k ? ]) fig.55 output source current - (vcc-vout) (vcc/vee=5[v]/0[v])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 23/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r (*)the data above is ability value of sample, it is not guaranteed. fig.56 output source current - (vout-vee) ( vcc/vee=5 [ v ] /0 [ v ]) fig.57 input offset voltage - common model input voltage (vcc/vee=15[v]/-15[v]) fig.58 input offset voltage - supply voltage fig.59 input offset voltage - ambient temperature
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 24/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.60 input bias current - supply voltage fig.61 input bias current - ambient temperature fig.62 large signal voltage gain -supply voltage fig.63 large signal voltage gain -ambient temperature
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 25/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.64 common mode rejection ratio -supply voltage fig.65 common mode rejection ratio -ambient temperature fig.66 slew rate l-h - supply voltage (rl=10[k ? ]) fig.67 slew rate l-h - ambient temperature (rl=10[k ? ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 26/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r (*) the data above is ability value of sample, it is not guaranteed. fig.68 voltage gain - frequency (vcc=7.5[v]/-7.5[v], av=40[db], rl=2[k ? ],cl=100[pf],ta=25[ ]) fig.69 input / output voltage - time (vcc/vee=15[v]/-15[v], av=0[db], rl=2[k ? ],cl=100[pf],ta=25[ ]) fig.70 input / output voltage - time (vcc/vee=15[v]/-15[v], av=0[db], rl=2[k ? ],cl=100[pf],ta=25[ ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 27/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r BA3474r fig.71 derating curve fig.72 supply current - supply voltage fig.73 supply current - ambient temperature fig.74 high level output voltage - supply voltage (rl=10[k ? ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 28/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.75 high level output voltage - ambient temperature (rl=10[k ? ]) fig.76 low level output voltage - supply voltage (rl=10[k ? ]) fig.77 low level output voltage - ambient temperature (rl=10[k ? ]) fig.78 output source current - (vcc-vout) (vcc/vee=5[v]/0[v])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 29/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r (*)the data above is ability value of sample, it is not guaranteed fig.79 output source current - (vout-vee) (vcc/vee=5[v]/0[v]) fig.80 input offset voltage - common model input voltage (vcc/vee=15[v]/-15[v]) fig.81 input offset voltage - supply voltage fig.82 input offset voltage -ambient temperature
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 30/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.83 input bias current - supply voltage fig.84 input bias current - ambient temperature fig.85 large signal voltage gain - supply voltage fig.86 large signal voltage gain -ambient temperature
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 31/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r fig.87 common mode rejection ratio -supply voltage fig.88 common mode rejection ratio - ambient temperature fig.89 slew rate l-h - supply voltage (rl=10[k ? ]) fig.90 slew rate l-h - ambient temperature (rl=10[k ? ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 32/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r (*)the data above is ability value of sample, it is not guaranteed fig.91 voltage gain - frequency (vcc=7.5[v]/-7.5[v], av=40[db], rl=2[k ? ],cl=100[pf],ta=25[ ]) fig.92 input / output voltage - time (vcc/vee=15[v]/-15[v], av=0[db], rl=2[k ? ],cl=100[pf],ta=25[ ]) fig.93 input / output voltage - time (vcc/vee=15[v]/-15[v], av=0[db], rl=2[k ? ],cl=100[pf],ta=25[ ])
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 33/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r application information test circuit 1 null method vcc, vee, ek, vicm unit : [v] parameter vf s1 s2 s3 vcc vee ek vicm calculation input offset voltage vf1 on on off 15 -15 0 0 1 input offset current vf2 off off off 15 -15 0 0 2 input bias current vf3 off on off 15 -15 0 0 3 vf4 on off large signal voltage gain vf5 on on on 15 -15 +10 0 4 vf6 15 -15 -10 0 common-mode rejection ratio (input common-mode voltage range) vf7 on on off 15 -15 0 -15 5 vf8 15 -15 0 13 power supply rejection ratio vf9 on on off 2 -2 0 0 6 vf10 18 -18 0 0 calculation 1. input offset voltage (vio) 2. input offset current (iio) 3. input bias current (ib) 4. large signal voltage gain (av) 5. common-mode rejection ratio (cmrr) 6. power supply rejection ratio (psrr) test circuit2 switch condition sw no. sw 1 sw 2 sw 3 sw 4 sw 5 sw 6 sw 7 sw 8 sw 9 sw 10 sw 11 sw 12 sw 13 sw 14 supply current off off off on off on off off off off off off off off high level output voltage off off on off off on off off on off off off on off low level output voltage off off on off off on off off off off off off on off output source current off off on off off on off off off off off off off on output sink current off off on off off on off off off off off off off on slew rate off off off on off off off on on on off off off off gain bandwidth product off on off off on on off off on on off off off off equivalent input noise voltage on off off off on on off off off off on off off off fig.94 test circuit 1 (one channel only) | vf1 | vio = 1 + rf / rs [v] | vf2 vf1 | iio = ri (1 + rf / rs) [a] | vf4 vf3 | ib = 2ri (1 + rf / rs) [a] ek(1+rf /rs) a v = 20log |vf5-vf6| [db] vicm(1+rf /rs) cmrr = 20log |vf8-vf7| [db] vcc(1+rf /rs) psrr = 20log |vf10-vf9| [db] vcc c2 0.1[f] rf 50[k ] s1 ri rs 10[k ] 50[ ] 10[k ] 50[ ] ri rs s2 rl s3 1000[pf] c3 500[k ] 500[k ] 0.1[f] rk ek rk c1 +15[v] -15[v] null v vf dut vee vicm
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 34/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r test circuit 3 channel separation vh vl v ?R rg ?R output voltage waveform time voltage input voltage waveform time vh vl voltage fig.95 test circuit 2 (one channel only) fig.96 slew rate input output wave fig.97 test circuit 3 sw1 sw2 sw3 sw10 sw11 sw12 a vin- vin+ rl vcc vee sw9 sw6 sw7 sw8 cl sw13 sw14 a v vout rs sw5 sw4 v r1 r2 vcc vee r1 v r2 r1//r2 vout1 =0.5[vrms] vin vcc vee r1 v r2 r1//r2 vout2 other ch cs 20 log 100 vout1 vout2
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 35/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r derating curves power dissipation(total loss) indicates the pow er that can be consumed by ic at ta=25 (normal temperature). ic is heated when it consumed power, and the temperature of ic chip bec omes higher than ambient temper ature. the temperature that can be accepted by ic chip depends on circuit configurati on, manufacturing process, and co nsumable power is limited. power dissipation is determined by the temperature allowed in ic chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). the maximum junction temperature is typically equal to the maximum value in the storage temperatur e range. heat generated by cons umed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol ja[ /w].the temperature of ic inside the package can be estimated by this thermal resistance. fig.98 (a) shows the model of t hermal resistance of the package. thermal resistance ja, ambient temperature ta, junction temperature tj, and power di ssipation pd can be calculated by the equation below: ja = (tj-ta) / pd [ /w] ????? ( ) derating curve in fig.98 (b) indicates power that can be consum ed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambi ent temperature. this gradient iis determined by thermal resistance ja. thermal resistance ja depends on chip size, power consumptio n, package, ambient te mperature, package condition, wind velocity, etc even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified cond ition. fig.99(c) ~ (f) shows a derating curv e for an example of ba3472, BA3474, ba3472r, BA3474r. (*10) (*11) (*12) (*13) (*14) (*15) (*16) (*17) (*18) (*19) unit 6.2 5.5 4.7 7.0 4.9 5. 0 5.7 7.5 9.5 13.5 [mw/ ] when using the unit above ta=25[ ], subtract the value above per degree[ ]. (*10) (*11) (*12) (*13) (*14) mounted on a glass epoxy 1 layers pcb 70[mm] 70[mm] 1.6[mm] (occupied copper area below 3[%]). (*15) mounted on a glass epoxy 2 layers pcb 70[mm] 70[mm] 1.6[mm] (occupied copper area 15mm 15mm). (*16) (*18) mounted on a glass epoxy 2 layers pcb 70[mm] 70[mm] 1.6[mm] (occupied copper area 70mm 70mm). (*17) (*19) mounted on a glass epoxy 4 layers pcb 70[mm] 70[mm] 1.6[mm] (occupied copper area 70mm 70mm). fig. 99 derating curve fig. 98 thermal resistance and derating curve (a) thermal resistance (b) derating curve ?? ta [ ] ? ? tj [ ] M p [w] ja = ( tj ` ta ) / pd [ /w] ambient temperature chip surface temperature 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ambient temperature power dissipation of lsi power dissipation pd [w] 0 200 400 600 800 1000 0 25 50 75 100 125 ?? [ ] S?p? pd [mw] 0 200 400 600 800 1000 1200 1400 1600 1800 0 25 50 75 100 125 ?? ta [ ] S?p? pd [mw] (e)ba3472r (f)BA3474r ba3472rfvm 590mw(*12) BA3474rfv 105 105 870mw(*13) 625mw(*15) 713mw(*16) 937mw(*17) 1187mw(*18) 1689mw(*19) 0 200 400 600 800 1000 0 25 50 75 100 125 ?? ta [ ] S?p? pd [mw] 0 200 400 600 800 1000 0 25 50 75 100 125 ?? ta [ ] S?p? pd [mw] (c)ba3472 870mw(*13) 590mw(*12) ba3472fvm ba3472f ba3472fv (d)BA3474 780mw(*10) 690mw(*11) 610mw(*14) BA3474f BA3474fv 85 85 power dissipation pd [mw] power dissipation pd [mw] power dissipation pd [mw] power dissipation pd [mw] ambient temperature: ta [ ] ambient temperature: ta [ ] ambient temperature: ta [ ] ambient temperature: ta [ ]
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 36/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r operational notes 1) unused circuits when there are unused circuits it is recommended that they are connected as in fig.100, setting the non-inverting input terminal to a potential within input common-mode voltage range (vicm). 2) input terminal voltage applying gnd + 36v to the input terminal is possible without causing deterioration of the electrical characte ristics or destruction, irrespective of the supply voltage. however, this does not ensure normal circuit operation. please note that the circui t operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 3) power supply (single / dual) the op-amp operates when the specif ied voltage supplied is between vcc and vee. therefore, the si ngle supply op-amp can be used as dual supply op-amp as well. 4) power dissipation pd using the unit in excess of the rated power dissipation may caus e deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capability. theref ore, please take into consideration the power dissipation (pd) under actual operating conditions and apply a sufficient margin in thermal design. refer to the thermal derating curves for more information. 5) short-circuit between pins and erroneous mounting incorrect mounting may damage the ic. in addition, the presenc e of foreign particles betwe en the outputs, the output and the power supply, or the output and gnd may result in ic destruction. 6) operation in a str ong electromagnetic field operation in a strong electromagnet ic field may cause malfunctions. 7) radiation this ic is not designed to withstand radiation. 8) ic handing applying mechanical stress to the ic by deflecting or bending the board may cause fluct uations in the electrical characteristics due to piezoelectric (piezo) effects. 9) board inspection connecting a capacitor to a pin with low impedance may stre ss the ic. therefore, discharging the capacitor after every process is recommended. in addition, when attaching and detac hing the jig during the inspec tion phase, ensure that the power is turned off before inspection and removal. furthe rmore, please take measures against esd in the assembly process as well as during transportation and storage. 10) output capacitor discharge of the external output capacitor to vcc is possible vi a internal parasitic elements when vcc is shorted to vee, causing damage to the internal circuitry due to thermal stress. therefore, when using this ic in circuits where oscillation due to output capacitive load does not occur, such as in vo ltage comparators, use an output capacitor with a capacitance less than 0.1f. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. fig.100 unused circuit example vcc vee + - please keep this potential in vicm
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 37/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r physical dimensions tape and reel information ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop8 0.9 0.15 0.3min 4 + 6 ? 4 0.17 +0.1 - 0.05 0.595 6 4 3 8 2 5 1 7 5.0 0.2 6.2 0.3 4.4 0.2 (max 5.35 include burr) 1.27 0.11 0.42 0.1 1.5 0.1 s 0.1 s (unit : mm) sop14 7 14 1.27 0.11 1 8 0.3min 8.7 0.2 0.4 0.1 0.15 0.1 1.5 0.1 6.2 0.3 4.4 0.2 (max 9.05 include burr) 0.1 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) ssop-b8 0.08 m 1234 5 6 7 8 0.1 0.22 0.10 0.3min 0.65 (0.52) 3.0 0.2 0.15 0.1 6.4 0.3 1.15 0.1 4.4 0.2 (max 3.35 include burr) s 0.1
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 38/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin (unit : mm) msop8 0.08 s s 4.0 0.2 8 3 2.8 0.1 1 6 2.9 0.1 0.475 4 5 7 (max 3.25 include burr) 2 1pin mark 0.9max 0.75 0.05 0.65 0.08 0.05 0.22 +0.05 ? 0.04 0.6 0.2 0.29 0.15 0.145 +0.05 ? 0.03 4 + 6 ? 4 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) ssop-b14 8 7 14 1 0.10 6.4 0.3 4.4 0.2 5.0 0.2 0.22 0.1 1.15 0.1 0.65 0.15 0.1 0.3min. 0.1
datasheet www.rohm.com tsz02201-0rar0g200100-1-2 ? 2012 rohm co., ltd. all rights reserved. 39/39 27.feb.2012 rev.001 tsz22111 ? 15 ? 001 ba3472, ba3472r, BA3474, BA3474r marking diagrams product name package type marking ba3472 f sop8s 3472 fv ssop-b8 fvm msop8 rfvm msop8 3472r BA3474 f sop14 3474f fv ssop-b14 3474 rfv ssop-b14 3474r sop8(top view) part number marking lot number 1pin mark sop14(top view) part number marking lot number 1pin mark ssop-b8(top view) part number marking lot number 1pin mark ssop-b14(top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark
datasheet d a t a s h e e t notice - rev.001 notice precaution for circuit design 1) the products are designed and produced for applicatio n in ordinary electronic equipment (av equipment, oa equipment, telecommunication equipment, home appliances, amusement equipment, etc.). if the products are to be used in devices requiring extremel y high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel contro llers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the rohm sales staff in advance. if product malfunctions may re sult in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits in the case of single-circuit failure 2) the products are designed for use in a standard environment and not in any spec ial environments. a pplication of the products in a special environment can deteriorate product per formance. accordingly, verification and confirmation of product performance, prior to use, is recomm ended if used under the following conditions: [a] use in various types of liquid, includin g water, oils, chemicals, and organic solvents [b] use outdoors where the products are exposed to direct sunlight, or in dusty places [c] use in places where the products are exposed to sea winds or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use in places where the products are exposed to static electricity or electromagnetic waves [e] use in proximity to heat-producing componen ts, plastic cords, or other flammable items [f] use involving sealing or coating the prod ucts with resin or other coating materials [g] use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] use of the products in places subject to dew condensation 3) the products are not radiation resistant. 4) verification and confirmation of performance characte ristics of products, after on- board mounting, is advised. 5) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 6) de-rate power dissipation (pd) depending on ambient temperature (ta). when used in sealed area, confirm the actual ambient temperature. 7) confirm that operation temper ature is within the specified range described in product specification. 8) failure induced under deviant condition from what def ined in the product specific ation cannot be guaranteed. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the remainder of fl ux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the company in advance. regarding precaution for mounting / circu it board design, please specially refe r to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) the application examples, their const ants, and other types of information cont ained herein are applicable only when the products are used in accordance with standard methods . therefore, if mass production is intended, sufficient consideration to external conditions must be made.
datasheet d a t a s h e e t notice - rev.001 precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution during manufacturing and st oring so that voltage exceeding product ma ximum rating won't be applied to products. please take special care under dry condition (e.g. grounding of human body / equipment / so lder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriorate if the products are stored in the following places: [a] where the products are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] where the temperature or humidity exceeds those recommended by the company [c] storage in direct sunshine or condensation [d] storage in high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding recommended storage time period . 3) store / transport cartons in the correct direction, whic h is indicated on a carton as a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a dry bag. precaution for product label qr code printed on rohm product label is only for internal us e, and please do not use at cust omer site. it might contain a internal part number that is inconsistent with an product part number. precaution for disposition when disposing products please dispose them properly with a industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under controlled goods prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. prohibitions regarding industrial property 1) information and data on products, including application exam ples, contained in these specifications are simply for reference; the company does not guarantee any industrial pr operty rights, intellectual property rights, or any other rights of a third party regarding this information or data. ac cordingly, the company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the us e of the products listed herein. 2) the company prohibits the purchaser of its products to exercise or use the in tellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the company, other than the right to use, sell, or dispose of the products.

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